大和電機工業株式会社

Electroless Au plating for fineline circuit on PC board

（L/S＝30/30µm）

Electroless Ni/Pd/Au
plating for micro-circuit

Excellent soldering, wirebondability. 3layers plating:Ni/Pd/Au is improved surface mounting reliability.

Au Wire pull test

Ball share test

Au Plating for LTCC substrate

Electroless plating process for LTCC substrate silver electrode

Wire pull strength on thicktype electroless
Au plating film
Electrode: Electroless plating on Ag/Pt　　
Plating thickness : Ni3μm Au0.4μm N=50
Au wire : 30μmφ　　Bonder: Kaijo118CH (Full auto type)

Micro spot plating for micro connector

Spot plating is plated with technology only where necessary .
Can significantly reduce the amount of use Au.

Etching free plating without
using roughned process

Direct plating of
organic film material

Traditionally, when film formation to maintain smooth as glass and plastic, been using dry process is expensive.
Maintaining surface smoothness of the material, can form a solid film by this new plating process.
Maintain the smoothness of nanoscale.

Gold Tin Alloys by plating forming
for Brazing assembly

Can form the plating material is used in brazing electronic packaging devices.
80Au/20Sn alloys by plating forming.

	plating	traditinal
Oxdation	○	○
Base material selection	○	△
Out gas	○	○
wettability	○	○
Thicness control	◎	△
cost	○	△
Ratio control	○	△

Molten state of
plating Au80/Sn20

Molten state of
Traditional brazing